Alternate method and device for analysis of flip chip electrical connections

摘要

An alternative method and device for accessing the circuit region on a flip chip die are provided. The new method and device provide increased accuracy for accessing the electrical contacts within the circuit region. Such a method and device is necessary in order to analyze and resolve flaws among the electrical contacts between a flip chip die and the chip package. The new method and device is precise enough to avoid adding defects upon approach to the contact intended for analysis. Specific regions of the electrical contact can be isolated for study. The technique is equally efficient for mass fabrication design testing and analysis.