发明名称 |
Method of recovering encapsulated die |
摘要 |
A method of decapsulating a packaged die includes removing packaging material from the bottom section of a die-containing package to expose a die pan, removing the die pan, removing material between the die pan and the bottom surface of the die, using the bottom surface of the die to determine a grind plane substantially parallel to the top surface of the die, and removing packaging material from the top section of the die-containing package to form a top surface substantially planar to the grind plane, preferably intersecting the wire bonds on the face of the die.
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申请公布号 |
US6368886(B1) |
申请公布日期 |
2002.04.09 |
申请号 |
US20000663248 |
申请日期 |
2000.09.15 |
申请人 |
THE CHARLES STARK DRAPER LABORATORY, INC. |
发明人 |
VAN BROEKHOVEN PAUL;TUMMINELLI RICHARD P. |
分类号 |
H01L21/56;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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