| 摘要 |
PROBLEM TO BE SOLVED: To provide both an insulated base material, in which in the case of producing a multi-layer wiring board by using an insulated material of a semi-cured state, dimensional fluctuation is generated by the handling environment and a hot press and it is difficult that the conforming properties between layers are secured but in this invention, dimensional stability is excellent, and a printed-wiring board having high holding properties of wiring. SOLUTION: Such the prepreg is used as an insulating layer that adhesive layers are formed on both faces of a base material containing a precured thermosetting resin. Dimensional stability in the environment at temperature and relative humidity and before and after laminating and pressing is enhanced because a cured core is used. Further, the adhesive properties of both a conductor circuit and an intermediate connector can be secured because the adhesive layers are formed on both faces of the core. Furthermore, connection between layers can be secured by compressing conductive paste filled in the core by a wiring pattern. |
