| 摘要 |
PROBLEM TO BE SOLVED: To secure connecting reliability in the soldered joint over a long period even under the severe environmental condition. SOLUTION: This lead-free solder for high-low temperature used for a printed circuit board using in a test burn-in test has a composition containing, by weight, 3 to 3.5% Ag and 0.3 to 0.5% Cu, and the balance Sn.
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