发明名称 Thermal processing apparatus
摘要 A thermal processing apparatus includes a reaction vessel into which an object to be processed is conveyed, a furnace body disposed so as to surround the reaction vessel, and a heater disposed in a region surrounding the reaction vessel in the furnace body. The heater includes heating elements, each having a sealing member made of a ceramic material and a linear flexible resistance heat generating member sealed by the sealing member.
申请公布号 US6369361(B2) 申请公布日期 2002.04.09
申请号 US20010769499 申请日期 2001.01.26
申请人 TOKYO ELECTRON LIMITED 发明人 SAITO TAKANORI;TAKIZAWA TSUYOSHI;YAMAGA KENICHI
分类号 F27B17/00;C30B31/12;F27B5/14;F27D1/10;F27D1/12;F27D11/02;H01L21/22;H01L21/31;H05B3/62;(IPC1-7):F27B5/14 主分类号 F27B17/00
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