发明名称 APPARATUS FOR MOLDING PROJECTED PART
摘要 PROBLEM TO BE SOLVED: To provide a molding apparatus capable of enhancing productivity and capable of forming the surface of a projected part in an ideal state. SOLUTION: The molding apparatus 20 is equipped with at least two molding plates 10 arranged in parallel to each other so as to form a gap permitting the projected part to pass, a cooling means 2 provided to the respective molding plates 10, a vacuum means 3 and 4 provided to the molding plates 10 to evacuate the gap and air introducing means 5 and 6 for introducing air into the gap to form air cushions between the surfaces of the projected part and the surfaces of the molding plates 10.
申请公布号 JP2002103338(A) 申请公布日期 2002.04.09
申请号 JP20010191711 申请日期 2001.06.25
申请人 OMIPA SPA 发明人 CAZZANI FABIO
分类号 B29C33/42;B29C47/90;B29C47/94;B29K101/12;B29L7/00;B29L31/00 主分类号 B29C33/42
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