发明名称 POLISHING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve uniformity of working amount in polishing work of a workpiece, by reducing sliding resistance of a guide ring by means of a guide means and stabilizing the behavior of the guide ring. SOLUTION: Fluid such as air is fed into a pressure chamber 26 by a high pressure fluid source through a pressure control unit 28 and a fluid introducing passage 27. The fluid presses a diaphragm 25 to press a guide ring 21 on an abrasive cloth through a pressure ring 24 and a linear shaft 22. At this time, a guide means G supports the guide ring 21 to be movable vertically so that the sliding resistance of the guide ring 21 becomes small. The behavior of the guide ring 21 is stabilized at the time when the guide ring 21 is pressed. Therefore, the guide ring 21 can stably press the polishing cloth with pressing force approximately as same as that of a top ring 14, so that the uniformity of working amount in polishing work of a wafer 16 is kept.
申请公布号 JP2002103212(A) 申请公布日期 2002.04.09
申请号 JP20000289822 申请日期 2000.09.25
申请人 TOSHIBA MACH CO LTD 发明人 KAWAMO TAKAHIRO
分类号 B24B37/005;B24B37/30;B24B37/32;H01L21/304 主分类号 B24B37/005
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