Method and apparatus for reflowing solder paste using a light source

摘要

A method and apparatus for coupling a microelectronic component (114) to a printed circuit board (112) are disclosed. The component (114) is coupled to the circuit board (112) by placing leads (116) of component (114) in contact with conducting pads (118) on the circuit board (120), dispensing a bead of solder paste (110) onto the leads (116), and applying heat to the applied paste (110) to cause the solder to reflow. The solder bead is dispensed using a solder paste dispenser (108) and heated using a light source (102).