| 摘要 |
A semiconductor device which ensures high packaging reliability and maintains high power/ground plane characteristics and can be embodied inexpensively even when the device has a large number of terminals, as well as to provide a method of manufacturing the semiconductor device. Since the reliability of mounting of the solder balls 9 can be improved even when the system board 16 is of great size, there can be embodied a BGA-type semiconductor device having terminals in the number of 700 to 1000 pins or more, thus eliminating a necessity for mounting sockets, which would be required in the case of a PGA-type semiconductor device and contributing to a decrease in costs. Further, even when the number of terminal pins is increased further, since the signal terminals can be arranged in a full-matrix pattern with a high degree of freedom, the semiconductor chip 2 can be made compact. The bumps 3 formed between the semiconductor chip 2 and the BGA substrate 1 have high reliability, and hence a multi-pin semiconductor device can be embodied inexpensively.
|
