PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board together with its manufacturing method where a loop inductance is reduced for high reliability. SOLUTION: A chip capacitor 20 is provided directly below an IC chip 90, so the distance between the IC chip and the capacitor is shorter for reduced loop inductance. The first and second terminals 21 and 22 of the chip capacitor housed in a recess 30a of a core substrate 30 are connected to a via hole 46 formed at an inter-layer resin insulating layer 40 through a conductive bump 31 and a conductor circuit 34, for a high connection reliability.