SEMICONDUCTOR ACCELERATION SENSOR AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor acceleration sensor and its manufacturing method capable of reducing a cost and heightening precision. SOLUTION: As for a sensing element 1 formed by supporting an overlapping part 5 rockably on a support part 16 through a bending part 4, the back side of the support part 16 is joined to a lower cap 3 which is a first cap by anode joint. The overlapping part 5 is formed more thinly than the support part 16 so as to form a rocking space between the lower cap 3 and the center part. An upper cap 2 made of silicon which is a second cap is joined to the lower cap 3 by the anode joint in addition to the sensing element 1. A recessed part 2a for storing the bending part 4 and the overlapping part 5 of the sensing element 1 between the upper cap 2 and the lower cap 3 is formed by anisotropic etching, and the peripheral part of the recessed part 2a is joined to the lower cap 3.