SEMICONDUCTOR DEVICE PACKAGE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device package and a semiconductor device, for reducing sizes and cost. SOLUTION: A semiconductor device package 10 mounted with a semiconductor chip 38 for communications comprises: a circuit board 12, which is provided with external connection terminals 36 and chip mounting portions 22a mounted with semiconductor chips 38; a filter circuit layer 18, which is mounted on an inner layer side of the circuit board 12 and is electrically conductive with the semiconductor chip 38 to extracts a high frequency electric signal in a specified frequency band; and an antenna circuit layer 14, which is provided on a front layer of the circuit board 12 and is electrically connected to the filter circuit layer 18.