METHOD AND DEVICE FOR STEAM DRYING FOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for steam drying for wafer, with which a wafer can be dried clean by preventing the occurrence of liquid stagnation. SOLUTION: A thin stick 32 is abutted to the lowest part of a wafer 20 immersed in a solvent steam 18. When the condensed liquid of a solvent flowing down on the surface of the wafer 20 reaches the lowest part of the wafer 20, this liquid flows down from the thin stick 32 by surface tension thereof. Thus, the condensed liquid of the solvent can be prevented from being stagnated in the lowest part of the wafer 20, and the wafer 20 can be dried clean.