| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a flip-chip mounting surface acoustic wave filter which can miniaturize a multiband RF filter for a portable telephone, which can improve attenuation value and which is miniaturized. SOLUTION: A plurality of bump electrodes are installed on a first layer from the upper part of a package composed of a plurality of baseplates. A grounding electrode, which surrounds the circumference of the electrodes by keeping a gap, is installed. A plurality of lead electrodes connected to the bump electrodes through vias are installed on a second layer and thereafter. A plurality of surface acoustic wave filters are mounted on the package, having a structure in which the lead electrodes and terminal electrodes installed on the bottom face in the lowermost part of the plurality of baseplates are connected airtightly. Thereby, the multiband RF filter is constituted.</p> |
