| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance transfer accuracy significantly by cleaning the surface of an aligner in the exposure chamber. SOLUTION: An exposure chamber 1 is evacuated from below a grilled floor face 2a. When a specified degree of vacuum is reached in the exposure chamber 1, foreign matters, e.g. dust, are removed from the surface of a wafer chuck 11 or a hand 31 by means of a foreign matter remover 40. The foreign matters, e.g. dust, are dropped onto the grilled floor face 2a and discharged along with the exhaust air of evacuation.</p> |
