| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor panel device that effectively utilizes a sensor aperture area at maximum by interconnecting a glass substrate and an integrated circuit substrate through the use of other side of a light receiving face of the glass substrate. SOLUTION: In the sensor panel device provided with an optical sensor panel 5 and the integrated circuit substrate 4 on which a signal processing integrated circuit 7 driving the optical sensor panel is mounted, a connection circuit unit 9 that electrically connects the optical sensor panel 5 to the integrated circuit substrate 4 is joined with the opposite side of the optical sensor panel 5 from the light receiving face via a glass through-hole 8.
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