发明名称 PACKAGE FOR HOUSING PHOTOSEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a package which effectively prevents deterioration in the transmission characteristics for high frequency signals, which avoids increase in the back height of a photosemiconductor package, which effectively prevents decrease in the coupling efficiency of light in the environment test, and thereby, to control the operating property of a photosemiconductor device to be normal and stable for a long time. SOLUTION: The package has an electrode pad 6 for electric connection between a photosemiconductor device 3 and the outside and a cap 2 attached to the upper face of the base body 1 to seal the photosemiconductor device 3. The electrode pad is formed along two side lines which are opposing to each other on the lower face of a base body 1 and which are almost parallel to an optical fiber 5. A connection pad 8 is formed in the region extended from the region just under a mounting substrate 4 on the lower face and along the optical axis of the optical fiber 5, with the connection pad 8 possessing >=60% of the area of the extended region.
申请公布号 JP2002098861(A) 申请公布日期 2002.04.05
申请号 JP20000287456 申请日期 2000.09.21
申请人 KYOCERA CORP 发明人 YANAGISAWA MITSUO
分类号 G02B6/42;H01L23/02;H01L23/12;H01L31/02;H01S5/022;(IPC1-7):G02B6/42 主分类号 G02B6/42
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