| 摘要 |
The method is for casing of a chip (1) with integrated circuits on front face (2) having the role of sensors, in particular optical, in a central part and having electrical connection zones in a peripheral part, between the edges of chip and the central part. The method includes the bonding of rear face (16) of chip to the front face (17) of a substrate (8) having through-openings (9,11) and electrical connection zones (14,15) on the rear face (13), where the through-openings are situated laterally near the edges of chip; the linking of electrical connection zones on the front face of chip to those on the rear face of substrate by wires (18); the embedding of chip and connecting wires in an optically transparent material for encapsulation, to form a block (23) on the front face of substrate; and the cutting of substrate (8) round the encapsulated block following the block perimeter. The block perimeter is circular, and the cutting of substrate is following the circular perimeter of block. The cutting of substrate is by stamping. A claim is also included for semiconductor device or optical sensors casing obtained by the method. The substrate (8) is in the form of film, in particular of epoxy resin, with the connection zones printed or laminated. The front face (24) of encapsulation block (23) is flat, or presents a convex part (26) constituting an optical lens. The side (25) of encapsulation block is at least partly sectioned. The perimeter of encapsulation block passes near the corners of chip. |
