发明名称 METHOD FOR INSPECTING MOUNT CONDITION OF CONDUCTIVE BALL
摘要 PROBLEM TO BE SOLVED: To provide a method for inspecting the mount condition of a conductive ball capable of detecting a position of the ball with high accuracy. SOLUTION: The method for inspecting the mount condition of the conductive ball inspects the mount condition of the ball 4 mounted on an electrode 3 formed in a substrate 2. In the case that a mount surface is photographed so as to obtain an image of the mount surface, an illuminating light is projected onto the mount surface from all zenithal direction by an annular illuminator. A reflected light from the ball 4 and a reflected light from the upper surface of the electrode 3 are detected, thereby a glossy section b(4) corresponding the ball 4 and a glossy section b(3) corresponding the electrode 3 are obtained on a screen. A bright pixel number representing an total area of the glossy sections b in an inspection frame 12 is determined and compared to a threshold value, thereby the deviation of the ball 4 from the electrode 3 is detected. Therefore, the position of the ball is detected with high accuracy using the uniform lighting.
申请公布号 JP2002098511(A) 申请公布日期 2002.04.05
申请号 JP20000292058 申请日期 2000.09.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAZATO SHINICHI
分类号 G01B11/00;H01L21/60;H01L23/12;(IPC1-7):G01B11/00 主分类号 G01B11/00
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