| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce in size a surface acoustic wave device, and to prevent the occurrence of a distortion in the surface acoustic wave device or a surface- acoustic wave element. SOLUTION: The method for manufacturing the surface-acoustic wave device comprises a first step of disposing a plurality of surface acoustic wave elements 20 on a mounting set substrate 40, so as to form a space between comb-like electrodes of the elements 20 and one surface of the substrate 40, and connecting the connecting electrodes of the elements 20 to conductor patterns of the substrate 40 by flip-chip bonding. The method further comprises a second step of disposing a sealing substrate 50 for counterposing the substrate 40 via the elements 20, and disposing a sealing material 51 between the substrate 40 and the substrate 50 around the elements 20 to seal the elements 20. The method also comprises a third step of cutting the substrate 40, the substrate 50 and the material 51 between the adjacent elements 20, and forming a plurality of the surface acoustic wave devices.</p> |
