| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device capable of preventing the peripheral part of a wafer from being unfastened by inclining a grinding member around the peripheral part of the wafer while grinding the wafer and of speedily controlling a contact pressure corresponding to the change of a contact area between a grinding plane and the surface of the wafer. SOLUTION: Annular permanent magnets 54 and 55, with which the direction of a magnetic field becomes the radial direction of a grinding member 40, are supported around the outer peripheral part of the grinding member 40. Plural coils 58 having horizontal portions orthogonal with the magnetic field are supported by locating a second moving stage 17, of a non-rotary member in the shape of circle almost concentric with these permanent magnets 54 and 55. When the coil 58 corresponding to the portion of the grinding member 40 to float from the surface of the wafer W is electrified during grinding of a wafer W of a substrate, a correction moment is applied to the grinding member 40 by generating a Lorentz's force between a current to flow through the horizontal portion of this coil 58 and the magnetic field, and the attitude of the grinding member 40 in respect to the surface of the wafer is kept constant. |
