| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliability of mounting semiconductor devices on a substrate by preventing generation of breakages or chippings of corners of the semiconductor device, when the semiconductor device is mounted on a mounting substrate. SOLUTION: The upper and bottom parts of each of four corners of a semiconductor device are recessed toward the inside to shape a recess 9. The structure of this recess shape 9, in which the corner is removed can prevent the generation of breakage or chipping of the corner parts, when the semiconductor device is mounted on a substrate. Accordingly, deterioration of the reliability for the secondary mounting can be prevented. Especially, breakages or chippings of a sealing resin 6 due to shock on the upper plane of the sealing resin 6 can be prevented.</p> |
