| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a solder bump where a solder bump is appropriately formed at a solder pad. SOLUTION: A flux is evenly applied on the entire surface of a solder resist layer 70. Then, by rolling a solder ball 77 formed into a ball in advance, it is placed on a solder pad 75a. The placed solder ball 77 is pressed for reflow so that a solder bump 78 of regular size is formed at the solder pad 75a. Thus, a fine and narrow-pitch solder bump is formed appropriately.
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