| 摘要 |
PROBLEM TO BE SOLVED: To obtain an LED array where chippings and crackings are eliminated and irregularities in printing is not caused. SOLUTION: A plurality of semiconductor substrates of continuous length are obtained, by performing a process A to a process C in this order. In the process A, an insulating film 6 is spread over the respective light-emitting element groups of a substrate, lattice-shaped guides are formed between the respective light-emitting element groups by using non film forming parts of the insulating film, and inner wall surfaces of long edge trenches 7a, 7b of the guide are made into curved surface shapes s, which are warped gradually starting from the direction of a lattice line. In the process B, the substrate is so arranged that a cutting blade is inserted in short edge trenches 7c, 7d of the guides, and cutting is made along the short edge trenches 7c, 7d of the guides, while carrying the substrate. In the process C, the substrate is arranged so that the cutting blade is made to abut against the inner surfaces of the curved surface shapes s of the long edge trenches 7a, 7b of the guides, and cutting is made along the long edge trenches 7a, 7b of the guides, while carrying the substrate. |
