| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is capable of being developed by exposing to ultraviolet rays and being developed by a dilute aqueous alkaline solution and is excellent in finger touch dryability when a coated film is dried and which has a wide range of heat control and high sensibility and is excellent in colose adhesion, heat-resistance, chemical resistance or the like and is suitable for a soldering resist film for a printed-wiring board, and also provide a printed-wiring board having a cured coated film using the same. SOLUTION: The photosensitive resin composition containing (A) an active energy beam-curable resin having at least two ethylenically unsaturated bonds in one molecule, (B) a compound having at least two allyl groups, (C) a photopolymerization initiator, (D) a reactive diluent and (E) an epoxy-based thermosetting curable compound. For the printed-wiring board, this composition is used. |
