| 摘要 |
PROBLEM TO BE SOLVED: To prevent adverse effects on peripheral components, where the adverse effects including fractures and a breakages (package cracks) of sealing resin, and a damages and defects due to gassing on the peripheral components, by controlling the gases generated from a material making up an internal element, during thermal treatment in reflow mounting and in an electronic component having the internal element sealed with the sealing resin. SOLUTION: As a material making up the internal element of the electronic component, which is sheathed with molded resin, a material is selected which is 3% or smaller or desirably 1.5% or smaller in ratio of decrease of weight, when heating is performed from room temperature to 200 to 260 deg.C.
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