| 摘要 |
PROBLEM TO BE SOLVED: To provide technology for raising the temperature of the solder layer of an electronic component having large heat capacity, while the temperature of electronic components with small heat capacity is increased. SOLUTION: A coil X, which is an electronic component having large heat capacity and small aluminum electrolytic capacitors which is electronic components with small heat capacity are loaded on the substrate part 20 of a printed board 10A. In a region shown by a dotted line, a conductor layer 30 arranged in the substrata part 20 (back side of the plane of figure) extends. The conductor layer 30 is arranged in a region, which includes a region on which the electronic component (coil X) with large heat capacity is mounted and does not include a region on which the electronic components (capacitors Y) having small heat capacity are mounted, when the substrate part 20 is plane- viewed.
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