| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for a semiconductor device, which is new and has excellent adhesion, wire bonding properties and blanking characteristic, and to provide a semiconductor device using it. SOLUTION: An adhesive sheet for a semiconductor device, which has a laminate composed of at least one layer of an organic insulating film and an adhesive layer, where the haze value of the adhesive sheet is 20 or less.
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