发明名称 METHOD, TOOL, AND DEVICE FOR SELECTING PARTS
摘要 <p>PROBLEM TO BE SOLVED: To provide a part-selecting method, a part-selecting tool, and a part- selecting device that can reliably separate mutually adhered parts from parts that have not adhered each other, and a manufacturing method of ceramic electronic components that includes a process for using the part-selecting device for selecting the parts that do not adhere. SOLUTION: In an upper plate 12, a through hole 11 with specific size for allowing a part 3 to pass with specific posture is provided. In a lower plate 22, a through hole 21 for allowing the part 3 passing through the through hole 11 on the upper plate 12 to pass regardless of the posture is provided. In the part-selecting tool A, the upper and lower plates 12 and 22 are at upper and lower parts while the plates are opposite each other at an interval G larger than length L of the part 3, and at the same time the center positions of the through holes 11 and 21 provided on the plates 12, 22, respectively, are shifted. The part 3 is supplied onto the upper plate 12 of the part-selecting tool A, and at the same time at least one of vibration, slanting, and rocking is applied to the part-selecting tool A, thus allowing the part 3 having specific dimension conditions to pass through the through holes 11 and 21 of the upper and lower plates 12 and 22 for selecting.</p>
申请公布号 JP2002100545(A) 申请公布日期 2002.04.05
申请号 JP20000286537 申请日期 2000.09.21
申请人 MURATA MFG CO LTD 发明人 SHIMIZU SHOGO
分类号 H01G4/12;H01G13/00;(IPC1-7):H01G13/00 主分类号 H01G4/12
代理机构 代理人
主权项
地址