| 摘要 |
PROBLEM TO BE SOLVED: To provide a fixed sheet for dicing, with which the generation of chipping in dicing can be prevented without lowering the yield of an object to be cut such as semiconductor wafer. SOLUTION: In the fixed sheet for dicing provided with an adhesive layer on a base material film, the fixed sheet for dicing is to be used, with which the base polymer of an adhesive agent forming the adhesive layer is a hot melt type thermoplastic resin and the storage elastic modulus of the adhesive layer is 1×106 to 1×109 Pa. |
