| 摘要 |
PROBLEM TO BE SOLVED: To provide a submount material which prevents the respected reflection of a laser beam on the end surface of the submount material to enable a reduction in noise, lessens the peeling of a metallic circuit layer even in the case where a thermal shock acts on the submount material in an assembly process for the submount material or during the use of the submount material, and is excellent in a heat dissipation property, a durability and a reliability. SOLUTION: A submount material 4a is provided with a ceramic board 2a consisting of a sintered compact containing an aluminum nitride as its main component and a metallic circuit layer 3a formed on this board 2a. In the submount material 4a for mounting a diode, the ceramic board 2a contains 0.05 to 5.0 wt.% of at least one kind of a colored material among W, Ti, Zr, Hf, Cr, Mo and Sr. |
