| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board having a smooth surface for preventing a wiring circuit in a circuit forming process from being peeled off, preventing the drop in productivity due to dirt of a cushioning material and smoothly embedding of the wiring circuit. SOLUTION: Metal foils where projecting parts being the wiring circuits are formed are heated, pressurized and laminated on both faces of a half-setting resin base material where holes are filled with conductive paste by making the protrusions face a resin base material side. The unwanted part of the metal foils is removed, after the resin base material has set, and the wiring circuit is exposed to the surface of the resin base material.
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