| 摘要 |
PROBLEM TO BE SOLVED: To provide heat conducting plates, a heat sink assembly, and the manufacturing methods thereof which are easy to carry out, and further, the detachments of the individual thermally conducting plate and heat sink can be made easily. SOLUTION: Heat conducting plates 21 are provided in an electronic- component mounting apparatus, having mounted electronic components, after they have been created by punching with a punching press a plate 10 which is superior in thermal conductivity, they are further returned to be engaged to the punched portions of the plate 10.
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