| 摘要 |
The electronic power module comprises at least two power components (1a,1b) which are insulated-gate bipolar transistors (IGBTs) connected in series and laid out in proximity so that one of the components is an inverted position, and both are sandwiched between two substrates (2a,2b) related to the collector and the emitter surfaces of the power components. One of the substrates (2b) is with a strip conductor (3) connecting the emitter of the first power component (1a) to the collector of the second power component (1b), and the other substrate (2a) is with at least two mutually insulated strip conductors (4,5) connected to the collector of the first power component and the emitter of the second power component, respectively, and subjected to electric supply potentials (+HV,-HV). The electric contact between the emitter of the first power component (1a) and the strip conductor (3) is by means of solder balls (6), e.g. of tin-lead-silver alloy, and the contact is obtained by fusion at e.g. 330 deg.C in 10 sec. The electric contact between the collector of the second power component (1b) and the strip conductor (3) is by soldering, e.g. a layer of tin-lead alloy. Each power component (1a,1b) is accompanied by a diode (7a,7b) which is connected in parallel with the respective power component. The substrates (2a,2b) e.g. ceramic or silicon are also equipped with strip conductors for control connected to the gates of the power components, and with heat-radiators for cooling the power components positioned on external surfaces of the substrates. A branch of waveform generator comprises one or more electronic power modules. |
