发明名称 |
Thermoplastic resin composition and moldings therefrom |
摘要 |
A thermoplastic resin composition comprising (A) 100 weight parts thermoplastic resin, (B) 0.1 to 100 weight parts of a mixture of (b-1) thermoplastic resin and (b-2) polyorganosiloxane that has a viscosity at 25° C. of at least 1,000,000 mPa-s, and (C) 0.1 to 100 weight parts polyorganosiloxane-bonded thermoplastic resin in which (c-1) thermoplastic resin and (c-2) polyorganosiloxane are chemically bonded to each other.
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申请公布号 |
US2002040101(A1) |
申请公布日期 |
2002.04.04 |
申请号 |
US20010829607 |
申请日期 |
2001.04.10 |
申请人 |
FURUKAWA HARUHIKO;SHIROMOTO KOJI;UEKI HIROSHI;MORITA YOSHITSUGU |
发明人 |
FURUKAWA HARUHIKO;SHIROMOTO KOJI;UEKI HIROSHI;MORITA YOSHITSUGU |
分类号 |
C08J5/00;C08L23/02;C08L23/10;C08L51/06;C08L53/00;C08L83/04;C08L83/10;C08L101/00;(IPC1-7):C08F8/00 |
主分类号 |
C08J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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