发明名称 Thermoplastic resin composition and moldings therefrom
摘要 A thermoplastic resin composition comprising (A) 100 weight parts thermoplastic resin, (B) 0.1 to 100 weight parts of a mixture of (b-1) thermoplastic resin and (b-2) polyorganosiloxane that has a viscosity at 25° C. of at least 1,000,000 mPa-s, and (C) 0.1 to 100 weight parts polyorganosiloxane-bonded thermoplastic resin in which (c-1) thermoplastic resin and (c-2) polyorganosiloxane are chemically bonded to each other.
申请公布号 US2002040101(A1) 申请公布日期 2002.04.04
申请号 US20010829607 申请日期 2001.04.10
申请人 FURUKAWA HARUHIKO;SHIROMOTO KOJI;UEKI HIROSHI;MORITA YOSHITSUGU 发明人 FURUKAWA HARUHIKO;SHIROMOTO KOJI;UEKI HIROSHI;MORITA YOSHITSUGU
分类号 C08J5/00;C08L23/02;C08L23/10;C08L51/06;C08L53/00;C08L83/04;C08L83/10;C08L101/00;(IPC1-7):C08F8/00 主分类号 C08J5/00
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