| 摘要 |
PURPOSE: A method for mounting electronic parts is provided to enhance the productivity and yield of the parts by correcting leads released during mounting processes of the parts. CONSTITUTION: The method for mounting electronic parts comprises an absorption step, a test step, a mounting step and a repetition step. In the absorption step, parts to be mounted are absorbed. In the test step, the absorbed parts are tested so that the release status of leads of the parts can be determined. In the mounting step, the absorbed parts are mounted on a PCB if the leads of the parts are not released. In the repetition step, the test step is repeated after the released leads are corrected if the leads are released. The leads of the absorbed parts are corrected by the repetition step, thereby enhancing the productivity and yield during mounting the parts.
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