| 摘要 |
An improved high speed connector is provided in which conductive pads (34) are alternately disposed on both sides of a board (10). The conductive pad (34a) transmits a + differential signal, and the conductive pad (34b) transmits a - differential signal. These conductive pads are disposed on the same surface (10a). The pad (34c) used for grounding is disposed on the opposite surface (10b) so that this pad (34c) is positioned between the conductive pads (34a) and (34b), thus forming one set of pads. In the case of the conductive pads (34d), (34e) and (34f) of another adjacent set, the pad (34d) which transmits a - differential signal is disposed on the same side as the pad (34b) of the previous set which transmits the same - differential signal. The pad (34f) used for grounding is disposed on the opposite side from the pads (34d) and (34e). The pad of a third set (not shown in the figures) which is adjacent to the pad (34e) that transmits a + differential signal is a pad that transmits the same + differential signal. As a result, signal crosstalk is reduced.
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