| 摘要 |
A device for cleaning a wafer of abrasive agent suspension (slurry) remaining after polishing with brushes and DI water includes an upper gear casing having an upper side with an end, a motor in the upper gear casing, a drive shaft, an upper gear mechanism, and a lower gear casing substantially mirroring the upper gear casing. The lower receiving plate and upper receiving plate form a brush unit, between which a part of a wafer can be clamped and cleaned by rotating the brush unit. The lower gear mechanism turns the lower drive wheel in a same direction as the upper drive wheel. The cleaning is achieved by a rotational movement of a number of pairs of brushes (scrubber brushes) on both sides of the wafer and the application of deionized water.
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