| 摘要 |
PURPOSE: A method for manufacturing a tantalum chip condenser is provided to increase the size of devices formed on an internal of the tantalum chip condenser by employing a lead frame. CONSTITUTION: Connection units(32) are formed in a line between mold products(50). The mold products(50) are impregnated into a metal coating solution(36) of a plating bath(34). The mold products(50) are impregnated into a mixing solution made of palladium(Pd) and nickel(Ni). The mold products(50) are impregnated into a mixing solution made of tin(Sn) and lead(Pb) on an upper layer of nickel-plated layer. Both sides of the united mold product are connected to grounding units(42,44) to connect (-) power(40) and (+) power(38). An abrasion about the central part of the mold products(50) is performed. If the abrasion is completed, terminal units(46,48) are formed on both sides of the mold products(50). The connection units(32) connected to the mold products(50) are disconnected. The terminal units(46,48) for a tantalum chip condenser(30) are formed. |
