发明名称 |
Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board |
摘要 |
A micro-etching composition and a printed circuit board fabricated by using the micro-etching composition are provided. The micro-etching composition, comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source, can continuously treat the surface of copper and copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit. The printed circuit board exhibits excellent adhesion between inner layer circuit patterns and insulation resin layers, and is free from haloing.
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申请公布号 |
US2002038790(A1) |
申请公布日期 |
2002.04.04 |
申请号 |
US20010912318 |
申请日期 |
2001.07.26 |
申请人 |
MEC CO., LTD. |
发明人 |
KURII YOSHIHIRO;KAMEDA ETSUJI;NAKAMURA SACHIKO |
分类号 |
C23F1/18;H05K3/38;(IPC1-7):H01B13/00;C03C15/00;C03C25/68;C23F1/00;C25F3/00 |
主分类号 |
C23F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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