| 摘要 |
<p>A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The invention provides a uniform polishing of a semiconductor wafer (4).</p> |
