发明名称 TOOL FOR APPLYING RESILIENT TAPE TO CHUCK USED FOR GRINDING OR POLISHING WAFERS
摘要 <p>A tool for applying an adhesive tape (34) to the face (6) of a chuck (12), includes a removable vacuum chamber (24) that is brought into sealing engagement with the chuck and that is indexed with respect to the chuck by locating pins (32). The vacuum chamber includes a stamp (28) on which the tape is mounted and to which the tape is indexed by locating pins. The stamp is advanced with the vacuum chamber toward the chuck until the tape contacts the face of the chuck. The stamp is withdrawn from the chuck, the vacuum is relieved, and the vacuum chamber is removed from the chuck. The holes in the tape register with those in the face of the chuck, and air is prevented from being trapped between the chuck by the vacuum chamber.</p>
申请公布号 WO2002026441(A1) 申请公布日期 2002.04.04
申请号 US2001030171 申请日期 2001.09.26
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