| 摘要 |
<p>A low-inductance connection between a first component (18) and a second component (20) on a first surface (14) of a first printed-circuit board (12) includes a second conducting path (32) in electrical communication with a first conducting path (26) that connects the first and second components (18, 20). The second conducting path (32) is disposed on a surface (30) separated from the first surface (14) of the first printed-circuit board (12) and separated from the first printed-circuit board (12) by an insulating layer (38). An electrical connector (40) extends between the first conducting path (26) and the second conducting path (32) and provides electrical communication between them. The first and second conducting paths (26, 32) thus cooperate to provide an electrical connection having a parasite incuctance that is smaller than the parasitic inductance of the first conducting path (26).</p> |
