POLYMER STUD GRID ARRAY AND METHOD FOR PRODUCTION THEREOF

摘要

A first wiring layer (V1) and metallised through connection holes (D) are formed on a substrate (S). A substrate layer (SL) is then applied to the upper surface (O1) of the substrate (S), by means of injection moulding, whereby the material extends through the through connection holes (D) and forms polymer ridges (PS) on the underside (U) of the substrate (S). A second wiring layer (V2) is formed on the substrate layer (SL) and electrically connected to the first wiring layer (V1) by means of blind hole contacts (SD) and thus to external connections (AA) on the polymer ridges (PS) by means of the through contact holes (D).