| 摘要 |
PURPOSE: Provided are an epoxy resin composition for sealing a semiconductor, which shows excellent moldability, flame retardancy, low absorbance, and solder resistance, and a semiconductor device using the epoxy resin composition. CONSTITUTION: The epoxy resin composition comprises (a) an epoxy resin having 70% or more of aromatic carbon atom out of total carbon atom in the epoxy resin; (b) a phenol resin having 70% or more of aromatic carbon atom out of total carbon atom in the phenol resin and a phenolic hydroxyl equivalent of 140-300; (c) a hardening accelerator; and (d) an inorganic filler. The amount of added inorganic filler satisfies the following condition of 88 <= W <= 94(W: weight%). An ignition initiation temperature of the cured epoxy resin compound in thermogravimetric analysis under atmosphere is 280 deg.C or more. |
