A METHOD FOR TRANSFERRING AND STACKING OF SEMICONDUCTOR DEVICES

摘要

The present invention is related to a method of producing an apparatus comprising at least one semiconductor device (21), said method being characterized by the fact that it comprises the following steps : forming a stack of layers, being substantially semiconductor layers, on a first substrate (1), singulating the whole of said first substrate (1) and said stack of layers, to obtain a plurality of sub-parts, attaching at least one of said sub-parts to a second substrate (9), whereby contact is made between said second substrate and said stack of layers, removing from each sub-part thus attached, essentially the singulated part of said first substrate, the remainder of said sub-part thus forming a semiconductor device (21) on said second substrate.