发明名称 |
BONDED WAFER OPTICAL MEMS PROCESS |
摘要 |
A microelectromechanical system is fabricated from a substrate having a handle layer, a silicon sacrificial layer and a device layer. A micromechanical structure is etched in the device layer and the underlying silicon sacrificial layer is etched away to release the micromechanical structure for movement. One particular micromechanical structure described is a micromirror. |
申请公布号 |
WO0212116(A3) |
申请公布日期 |
2002.04.04 |
申请号 |
WO2001US41523 |
申请日期 |
2001.08.03 |
申请人 |
ANALOG DEVICES, INC. |
发明人 |
BROSNIHAN, TIMOTHY, J.;JUDY, MICHAEL, W. |
分类号 |
B81B3/00;B81B7/02;B81C1/00;G02B26/08 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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