METHOD FOR FORMING SOG LAYER ON WAFER

摘要

PURPOSE: A method for forming an SOG(Spin On Glass) layer on a wafer is provided to prevent a rinse error by using an SOG solution including toluene of 3 and less percent. CONSTITUTION: A wafer(200) is loaded on a rotary support plate. An SOG solution injection hole(300) is induced to a front direction of the wafer(200). The SOG solution is dropped from the SOG solution injection hole(300) into the wafer(200). The SOG solution is spread on a surface of the wafer(200) by rotating the wafer(200). An SOG layer(100) is formed on the wafer(200). A rinse nozzle(400) is induced to a rear direction of the wafer(300). The rinse solution is injected to an edge of the wafer(200). The SOG solution is removed from a rear face and a front face of the wafer(200). At this time, A rinse error is reduced by using the SOG solution including toluene of 3 and less percent.