发明名称 EXPOSURE METHOD, EXPOSURE APPARATUS, X-RAY MASK, RESIST, SEMICONDUCTOR AND FINE STRUCTURE
摘要 PURPOSE: Provided are an exposure method, an exposure apparatus, an X-ray mask and a resist to achieve enhancement in resolution and throughput, as well as a semiconductor device and a microstructure manufactured by means of them. CONSTITUTION: The exposure method comprises radiating X ray(2) emitted from an X-ray source(1) to a resist film(10) via an X-ray mask(8). A material constituting said resist film(10) is selected to absorb, by said resist film(10), X ray(2) having an average wavelength equal to or shorter than an average wavelength of X ray(2) radiated to said resist film(10). The exposure apparatus includes an X-ray mirror(3a,3b). The X-ray mirror(3a, 3b) has a surface reflecting X ray(2), and the surface is constituted of a material including at least one selected from the group consisting of hafnium, tantalum, tungsten, rhenium, osmium, iridium, and alloys, nitrides, carbides and borides of foregoing elements.
申请公布号 KR20020025055(A) 申请公布日期 2002.04.03
申请号 KR20010060232 申请日期 2001.09.27
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 FUJINO ATSUKO;ITOGA KENJI;KITAYAMA TOYOKI;KUMADA TERUHIKO;MARUMOTO KENJI
分类号 G21K1/06;G03F1/14;G03F1/16;G03F1/22;G03F7/004;G03F7/038;G03F7/039;G03F7/20;G21K3/00;H01L21/027;H05H13/04;(IPC1-7):G03F7/20 主分类号 G21K1/06
代理机构 代理人
主权项
地址