MULTICHIP MODULE AND METHOD FOR PRODUCING A MULTICHIP MODULE

摘要

Multi-chip module comprises a base chip, a top chip, an adhesive layer, an electrically conducting planarizing layer, a through-hole and a contact structure. Multi-chip module comprises a base chip (10) having a passivating layer (12) and a connecting layer (14); a top chip having a passivating layer (18) and a connecting layer (20); an adhesive layer (22) between the passivating layer (12) of the base chip and the lower side of the top chip and the top chip and the base chip; an electrically conducting planarizing layer (24) on the surface of the base chip and embedded in the top chip; a through-hole (26a) filled with electrically conducting material; and a contact structure (28, 30) to connect the electrically conducting material in the through-hole to the connecting surface of the top chip.